PRESS RELEASE – On the August 22, LG Innotek (CEO Moon, Hyuksoo) introduced that it’s going to companion with Ansys, the world’s prime engineering simulation firm, to develop the appliance of ‘Digital Twin’ expertise to all its processes.
‘Digital Twin’ is a expertise that replicates objects in a digital house to foretell the outcomes of attainable real-life conditions by laptop simulations. It’s heralded as a expertise able to fixing numerous industrial and social issues. Specifically, it’s being quickly deployed within the manufacturing trade as it might cut back product growth time and prices.
Ansys is understood to own world-leading expertise and deployment expertise within the area of simulation utilizing 3D modeling, Synthetic Intelligence (AI), and Machine Studying (ML). By collaborating with Ansys, LG Innotek will be capable of leverage its newest ‘Digital Twin’ options and simulation software program to construct a state-of-the-art ‘Digital Twin’ setting.
In collaboration with Ansys, LG Innotek carried out a trial utility of its ‘Digital Twin’ expertise to some growth and manufacturing processes and has achieved tangible outcomes. Sooner or later, the corporate plans to develop the appliance of ‘Digital Twin’ to the event and manufacturing processes of its whole product vary, together with autonomous driving elements reminiscent of car connectivity and sensing units.
Preliminary verification of designs utilizing digital simulation, lowering growth time by 99%
LG Innotek is reaping the advantages of its ‘Digital Twin’ in R&D. After verifying designs in a digital setting, the corporate makes use of the info to attenuate the variety of checks that should be carried out and the time it takes to conduct them.
It utilized ‘Digital Twin’ expertise to the event of bundle substrate (PS) merchandise for semiconductors, managing to scale back the event time by 99%.
Substrates require the minimization of ‘Warpage’ as a result of warmth and stress to which they’re uncovered throughout manufacturing. That is achieved by a simulation course of that optimizes the mixture of the circuit design construction and supplies composition ratio. Utilizing digital simulation by 3D modeling, LG Innotek has lowered the time required to foretell the diploma of ‘Warpage’ of a single substrate from 11 days to three.6 hours.
Rising deployment of ‘Digital Twin’ to FC-BGA and digital part manufacturing processes, maximizing manufacturing competitiveness
LG Innotek has expanded the appliance of ‘Digital Twin’ expertise to not solely product growth but in addition the FC-BGA (Flip-Chip Ball-Grid Array) manufacturing course of. Utilizing this expertise, the corporate has succeeded in halving the ramp-up interval (improve in manufacturing capability by enhancing yield within the early phases of mass manufacturing) by establishing optimum circumstances for the FC-BGA manufacturing tools.
Previously, the corporate needed to conduct a whole lot of checks to determine the optimum FC-BGA course of circumstances, which relied closely on money and time. Utilizing 3D modeling, it has replicated the FC-BGA manufacturing course of in a digital house.
Working the method in a digital house permits the pc to visualise and determine issues that would happen with numerous course of tools. This makes it attainable to meticulously optimize circumstances, such because the stream of liquids, warmth, and air that can’t be measured inside such tools.
As well as, LG Innotek has managed to extend productiveness by actively utilizing ‘Digital Twin’ within the manufacturing technique of digital car elements. Since digital car elements have an extended product lifespan and are extremely susceptible to the climate, making certain high quality and reliability is essential.
LG Innotek utilized ‘Digital Twin’ expertise to the soldering course of, which is a key course of for making certain the reliability of digital car elements. The soldering course of was simulated in a digital house to foretell the time it takes for the solder to crack. By optimizing course of circumstances reminiscent of the quantity of solder utilized and nozzle design to delay cracking as a lot as attainable, the corporate plans to extend productiveness by 40% in comparison with the earlier course of.
“LG Innotek to turn out to be a ‘meta-manufacturing’ firm by advancing Digital Twin expertise”
By way of its partnership with Ansys, LG Innotek plans to quickly develop using ‘Digital Twin’ expertise to all product traces and processes, together with new development companies reminiscent of car communication modules and LiDAR (mild detection and ranging) units.
Sooner or later, the corporate plans to develop using ‘Digital Twin’ expertise to prospects and companions throughout the complete worth chain, from growth to manufacturing. Because of this, companions and prospects will be capable of collaborate on product design and simulate the effectivity of manufacturing processes on the digital ‘Digital Twin’ platform constructed by LG Innotek.
All the knowledge generated within the digital house will likely be collected in actual time and used to enhance product design and buyer processes. All knowledge from LG Innotek, its companions, and prospects will likely be organically linked and shared in actual time, enabling systematic high quality management and environment friendly growth.
Moreover, AI will likely be utilized to the digital design and high quality course of verification to extend simulation pace and accuracy. AI will study from the info collected by simulation to derive optimum options and help decision-making by engineers. LG Innotek believes the productiveness good points will likely be multiplied by combining the strengths of virtualization and AI expertise.
LG Innotek Chief Expertise Officer S.David Roh mentioned, “The long run we envision at LG Innotek is meta-manufacturing, the place simulation outcomes from a digital house are linked to bodily manufacturing services and mechanically result in precise manufacturing.” He added, “To this finish, we’ll quickly apply superior ‘Digital Twin’ expertise to the complete worth chain, together with R&D, manufacturing, and high quality management, to create differentiated buyer worth.”
